Wafer Ring Supply Taping Device "NCT-6000"
Conduct electrical characteristic tests to automatically eject defective products! A device that can only tape good products.
The "NTC-6000" is an automatic taping device that picks up chip components using a wafer sheet, electrically inspects their characteristics, automatically ejects defective products, and tapes only the good ones. It is effective in preventing the outflow of defective products. 【Features】 ■ Optional support for sub-index specifications available ■ Can propose tape sets for ultra-small device applications such as 0603 ■ Automatic replacement function for in-tape image NG work ■ Cost-performance model device also available ■ Capable of back-side image inspection * For more details, please download the catalog or contact us.
- Company：ワイエイシイガーター
- Price：Other
